-40%
Gasonics Aura 1000 Plasma Asher Stripper System - Wafer Photoresist Cleaning
$ 26400
- Description
- Size Guide
Description
You are bidding on a Gasonics Aura 1000 Plasma Asher System. Refurbished, working with 30-day warranty.*Stock image used: this Gasonics Aura 1000 Plasma Asher is housed in
a functional, convenient table-top cabinet
configuration with stainless cart.
P
roduct Information:
The Gasonics Aura 1000 Plasma Asher System is a microprocessor
controlled down-stream, or “afterglow” photoresist stripper that will
strip the front and backside of a wafer, typically in less than one
minute. The unit is fully automated, cassette-to-cassette, and is a
single-wafer process design.
The Gasonics Aura 1000 Plasma Asher consists of two separate but
interconnected vacuum chambers (reaction and stripping), a microwave
plasma generator, automatic wafer loader/unloader, keypad panel/display,
mass flow controllers (MFCs), an infrared heat source, pneumatic and
electronic control systems, stainless steel gas plumbing, and
incorporates several safety interlock features, as well as
troubleshooting indicators – (LED’s) that illuminate to display the
operating sequence and key component function signals.
The Gasonics Aura 1000 Plasma Asher Stripper System generates a plasma
of oxygen and/or other gasses in a reaction chamber. This concentrated
reactive mixture then flows downstream, reaching a state of electrical
neutrality, and although highly reactive, it is no longer electrically
damaging to the wafer. The mixture then enters the process chamber,
where the dissociated oxygen-reacts-with the photoresist and oxidizes or
“burns” the photoresist from the wafer. The main components of the Aura
plasma reaction is atomic oxygen (normal oxygen consists of two atoms,
while atomic oxygen consists of only one. In addition, an infrared heat
source is included for difficult or temperature sensitive processes.
Gasonics Aura 1000 Plasma Asher System Features:
Single wafer processing
One-to-four process gas MFCs
3", 4", 5", and 6" wafer capability
Throughput: 60 WPH, depending on process parameters
Programmable microprocessor
Automatic wafer loader/unloader
Infrared heat source for process temperature control
Downstream processing: No wafer radiation damage
Soft-start vacuum system.
Quartz or Ceramic plasma chamber.
Equipped with hard-wired safety interlocks to prevent damage to the system or injury to either the product or to personnel.
Front and backside resist removal
Automatic photo emission type end-point detection
In-line cassette-to-cassette.
Compact: 36" x 32" x 27" (Table Top).
Visual alarm (flashing indicator) annunciates any illegal operation
or program error
XS 11430 RBT
Our eBay listings are available for viewing at our walk-in wholesale outlet:
Excess Solutions
1555 South 7th Street 4D
San Jose, CA 95112
Please see our website: www excesssolutions com for more information
Terms and Conditions:
Shipping
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